Solid state light emitter devices and methods

ABSTRACT

Solid state light emitter devices and methods are provided. A solid state light emitter device can include a submount having an upper surface and a bottom surface. At least first pair and a second pair of electrically conductive contacts can be disposed on the bottom surface of the submount. The first pair of contacts can be electrically independent from the second pair of contacts. The device can further include multiple light emitters provided on the upper surface of the submount. The multiple light emitters can be configured into at least a first light emitter zone that is electrically independent from a second light emitter zone upon electrical communication to a respective pair of contacts.

TECHNICAL FIELD

The subject matter disclosed herein relates generally to light emitterdevices and methods. More particularly, the subject matter disclosedherein relates to solid state light emitter devices and related methods.

BACKGROUND

Solid state light emitters, such as light emitting diodes (LEDs) or LEDchips, convert electrical energy into light. In some aspects, LED chipsare provided in different types of light emitter devices, for example,in surface mount design (SMD) type of devices for use in a variety ofdifferent lighting and optoelectronic applications.

As LED chips are narrow band gap emitters, challenges exist in providingcertain colors of light, for example, high quality white light that isnatural and/or vivid. Challenges also exist in providing simple andinexpensive solid state lighting solutions.

Manufacturers of LED lighting solutions are constantly seeking ways toreduce their cost in order to provide a lower initial cost to customers,and encourage the adoption of LED products. Devices incorporating fewerraw materials at sustained or increased brightness levels using the sameor less power are becoming more desirable.

Despite the availability of various light emitter devices in themarketplace, a need remains for improved devices and methods that haveimproved color quality, improved color rendering, are more efficient,cost effective, and/or improve the ease of manufacture.

SUMMARY

In accordance with this disclosure, improved light emitter devices andmethods are described herein. One exemplary light emitter devicecomprises a submount having an upper surface and a bottom surface, atleast a first pair and a second pair of electrically conductive contactsdisposed on the bottom surface of the submount, and multiple lightemitters disposed on the upper surface of the submount. The first pairof contacts is electrically independent from the second pair ofcontacts. The multiple light emitters are configured into at least afirst light emitter zone that is electrically independent from a secondlight emitter zone upon electrical communication to a respective pair ofcontacts.

Another exemplary embodiment of a light emitter device is provided. Thedevice includes a submount and a plurality of pairs of electricallyconductive traces disposed over the submount. Each pair of electricallyconductive traces is electrically independent. The device furthercomprises a plurality of light emitters disposed over the submount. Thelight emitters are configured in at least two light emitter zonesbetween the plurality of electrically conductive traces, and each lightemitter emits light from a light emitter surface that has at least twolines of symmetry about a central axis of the submount.

An exemplary method of providing a solid state light emitter devicecomprises providing a submount having an upper surface and a bottomsurface, providing at least first pair and a second pair of electricallyconductive contacts on the bottom surface of the submount, wherein thefirst pair of contacts is electrically independent from the second pairof contacts. The method further comprises providing multiple lightemitters on the upper surface of the submount and electricallyconfiguring the multiple light emitters into at least a first lightemitter zone that is electrically independent from a second lightemitter zone upon electrical communication to a respective pair ofcontacts.

These and other objects of the present disclosure as can become apparentfrom the disclosure herein are achieved, at least in whole or in part,by the subject matter disclosed herein.

BRIEF DESCRIPTION OF THE DRAWINGS

A full and enabling disclosure of the present subject matter includingthe best mode thereof to one of ordinary skill in the art is set forthmore particularly in the remainder of the specification, includingreference to the accompanying figures, in which:

FIGS. 1A to 1C are plan and perspective views illustrating a lightemitter device, or portions thereof, according to the disclosure herein;

FIGS. 2A to 2D are top plan views illustrating optional characteristicsassociated with light emitter devices according to the disclosureherein; and

FIGS. 3A to 3E are schematic views illustrating multiple light emitterzones within a single light emitter device according to the disclosureherein.

DETAILED DESCRIPTION

The subject matter herein discloses solid state light emitter devicesand methods, such as submount based light emitting diode (LED) devicesand methods. Notably, devices and methods described herein can comprisemultiple independent and distinct light emitter zones that areconfigured to emit light from either a same (e.g. single) light emittersurface or multiple (e.g., divided) light emitter surfaces. In someaspects, devices and methods herein comprise two or more light emitterzones per a single device. Each emitter zone can differ in regards topeak emission(s), color point(s), color temperature(s), chip color(s),chip size(s), chip spacing(s), chip count(s), chip structure(s), stringcount(s), string spacing(s), voltage, brightness, light output, phosphormaterial, phosphor content, phosphor loading, encapsulant material, lensmaterial, combinations thereof, or the like. The two or more lightemitter zones can differ in respect to any other conceivablecharacteristic relating to physical, structural, mechanical,dimensional, optical, material, chemical, and/or electrical properties.

Multiple distinct (discrete) light emitter zones can advantageouslyprovide customizable light emissions, improved color mixing, improvedcolor rendering, improved color uniformity, improved color quality,improved thermal properties, improved optical properties, and/orimproved ease of manufacture. Providing a single device utilizing two ormore independently controllable light emitter zones allows forflexibility in accommodating multiple different lighting applications.

In some aspects, devices herein utilize multiple independent anddiscrete pairs of electrical contacts and/or traces for supplyingelectrical current to the multiple light emitter zones. For example,each device can comprise multiple different (discrete) pairs of surfacemount contacts (e.g., SMD contact pads) that are disposed on a bottomsurface of a device submount. The contact pads are electricallyconnected to multiple different (discrete) pairs of traces on a topsurface of submount. Each pair of contact pads and each pair of tracesconnected thereto can be individually electrically controllable, wheredesired, for passing either a same amount or different amounts ofcurrent through each light emitter zone for inducing desired lightemissions per zone.

The metallic traces on a top surface of the device submount can bespaced apart from the one or more light emitters (e.g., LED chips) on atop surface of a submount and disposed proximate the outermost edges ofthe submount for reducing any interference with, absorption of, and/orpotential blockage of light. Each trace can optionally be disposed belowa single, continuous reflective or non-reflective material, such as asingle reflector, reflective wall, or “dam”. Individual traces can alsobe disposed below multiple, separate reflective or non-reflectivestructures or dams. The two or more light emitter zones can beconfigured to emit light via a same (e.g., single) light emittersurface, or each zone can optionally be separated by one or moreoptional reflective or non-reflective structures or dams. Each lightemitter zone can comprise a regular shape that is symmetric about atleast one central axis or plane and has at least one line of symmetry ortwo or more lines of symmetry about the central axis or plane.

Reference will be made in detail to possible aspects or embodiments ofthe subject matter herein, one or more examples of which are shown inthe figures. Each example is provided to explain the subject matter andnot as a limitation. In fact, features illustrated or described as partof one embodiment can be used in another embodiment to yield still afurther embodiment. It is intended that the subject matter disclosed andenvisioned herein cover such modifications and variations.

As illustrated in the various figures, some sizes of structures orportions are exaggerated relative to other structures or portions forillustrative purposes and, thus, are provided to illustrate the generalstructures of the present subject matter. Furthermore, various aspectsof the present subject matter are described with reference to astructure or a portion being formed on other structures, portions, orboth. As will be appreciated by those of skill in the art, references toa structure being formed “on” or “above” another structure or portioncontemplates that additional structure, portion, or both may intervene.

References to a structure or a portion being formed “on” anotherstructure or portion without an intervening structure or portion aredescribed herein as being formed “directly on” the structure or portion.Similarly, it will be understood that when an element is referred to asbeing “connected”, “attached”, or “coupled” to another element, it canbe directly connected, attached, or coupled to the other element, orintervening elements can be present. In contrast, when an element isreferred to as being “directly connected”, “directly attached”, or“directly coupled” to another element, no intervening elements arepresent.

Furthermore, relative terms such as “on”, “above”, “upper”, “top”,“lower”, or “bottom” are used herein to describe one structure's orportion's relationship to another structure or portion as illustrated inthe figures. It will be understood that relative terms such as “on”,“above”, “upper”, “top”, “lower” or “bottom” are intended to encompassdifferent orientations of the device in addition to the orientationdepicted in the figures. For example, if the device in the figures wereturned over, structure or portion described as “above” other structuresor portions would now be oriented “below” the other structures orportions. Likewise, if devices in the figures are rotated along an axis,structure or portion described as “above”, other structures or portionswould be oriented “next to” or “left of” the other structures orportions. Like numbers refer to like elements throughout.

Unless the absence of one or more elements is specifically recited, theterms “comprising”, including”, and “having” as used herein should beinterpreted as open-ended terms that do not preclude the presence of oneor more elements.

The terms “light emitter” and “light emitter device” as used herein arenot limited in any respect other than being capable of emitting light.Light emitters can comprise any type of solid state light emitter oremitter chip, LED chip (packaged, unpackaged, or bare), a laser diode,an organic LED chip, and/or any other semiconductor device arranged as asemiconductor chip that comprises one or more semiconductor layers,which can comprise Si, SiC, GaN, and/or other semiconductor materials.

Light emitters described herein can emit any wavelength and/or color oflight. Where multiple light emitters are used, the emitters can eachemit a same color of light or different colors/combinations of light. A“color” of light refers to a light emitter's peak wavelength oflight/can be primarily blue, primarily red, primarily green, cyan,red-orange (RDO), orange, yellow, blue shifted yellow (BSY), ultraviolet(UV), infrared (IR), or the like.

Light emitters according to embodiments described herein can optionallycomprise group III-V nitride (e.g., gallium nitride (GaN)) based LEDchips or lasers. Fabrication of LED chips and lasers is generally knownand only briefly described herein. LED chips or lasers can be fabricatedon a growth substrate, for example, a silicon carbide (SiC) substrate,such as those devices manufactured and sold by Cree, Inc. of Durham,N.C. Other growth substrates are also contemplated herein, for exampleand not limited to sapphire, silicon (Si), and GaN.

Light emitters according to some embodiments described herein, forexample, can optionally be fabricated on growth substrates (e.g., Si,SiC, or sapphire substrates) to provide horizontal chips (with at leasttwo electrical contacts on a same side of the LED chip) or verticalchips (with electrical contacts on opposing sides of the LED chip). Insome aspects, the growth substrate can be maintained on the LED chipafter fabrication or removed (e.g., by etching, grinding, polishing,etc.). In other aspects, the growth substrate can be removed, forexample, to reduce a thickness of the resulting LED chip and/or toreduce a forward voltage through a vertical LED chip. A horizontal chip(with or without the growth substrate), for example, can be flip chipbonded (e.g., using solder) to a carrier substrate or printed circuitboard (PCB), or wirebonded. A vertical chip (with or without the growthsubstrate) can have a first terminal (e.g., anode or cathode) solderbonded to a carrier substrate, mounting pad, or PCB and a secondterminal (e.g., the opposing anode or cathode) wirebonded to the carriersubstrate, electrical element, or PCB.

Examples of vertical and horizontal LED chips (e.g., or structures) arediscussed by way of example in U.S. Publication No. 2008/0258130 toBergmann et al. and in U.S. Pat. No. 7,791,061 to Edmond et al., whichissued on Sep. 7, 2010, the disclosures of which are hereby incorporatedby reference herein in their entireties.

Light emitters according to some embodiments described herein canoptionally be at least partially coated with one or more lumiphoricmaterials, phosphoric materials, or phosphors. These materials areconfigured to absorb a portion of light emitted by the LED chip and emitlight at a different wavelength, allowing the resultant light emitterdevice to emit a combination of light from each of the LED chip and thephosphor. In one embodiment, light emitter devices described herein emitwhat is perceived as white light resulting from a combination of lightemission from the LED chip and the phosphor.

In some embodiments according to the present subject matter, whiteemitting devices include one or more LED chips that emit light in theblue wavelength spectrum and one or more phosphors that absorb some ofthe blue light and re-emit light in the green, yellow, and/or redwavelength spectrum. The devices can therefore emit a white lightcombination across the visible spectrum of light. In other embodiments,the LED chips can emit a non-white light combination of blue and yellowlight as described in U.S. Pat. No. 7,213,940, the entire contents ofwhich is incorporated herein by reference. Providing light emitters thatemit red light or emitters covered by a phosphor that absorbs light andemits a red light are also contemplated herein. Red and blue lightemitters can be discussed herein by way of example only; however, lightemitters are not limited to emission of red and blue light. Rather,light emitters described herein can emit any color of light, UV light,and/or IR light. It is understood that light emitter devices and methodsaccording to the present subject matter can also have multiple LED chipsof different colors, one or more of which can be white emitting.

Where used, phosphor(s) can be applied to a light emitter and/or lightemitter device according to any suitable method, with one suitablemethod being described in U.S. patent application Ser. Nos. 11/656,759and 11/899,790, both entitled “Wafer Level Phosphor Coating Method andDevices Fabricated Utilizing Method”, and both of which are incorporatedherein by reference in their entireties. Other suitable methods forcoating light emitters are described, for example, in U.S. Pat. No.8,058,088, which issued on Nov. 15, 2011, and U.S. patent applicationSer. No. 12/717,048, the disclosures of which are hereby incorporated byreference herein in their entireties. Light emitters can be coated usingother methods such as electrophoretic deposition (EPD), with a suitableEPD method described in U.S. patent application Ser. No. 11/473,089,which is also incorporated herein by reference in its entirety.

Some embodiments of the instant subject matter can comprise lightemitters, luminescent materials, and/or methods such as those describedin, for example, U.S. Pat. Nos. 7,564,180; 7,456,499; 7,213,940;7,095,056; 6,958,497; 6,853,010; 6,791,119; 6,600,175, 6,201,262;6,187,606; 6,120,600; 5,912,477; 5,739,554; 5,631,190; 5,604,135;5,523,589; 5,416,342; 5,393,993; 5,359,345; 5,338,944; 5,210,051;5,027,168; 5,027,168; 4,966,862, and/or 4,918,497, U.S. PatentApplication Publication Nos. 2009/0184616; 2009/0080185; 2009/0050908;2009/0050907; 2008/0308825; 2008/0198112; 2008/0179611, 2008/0173884,2008/0121921; 2008/0012036; 2007/0253209; 2007/0223219; 2007/0170447;2007/0158668; 2007/0139923, and/or 2006/0221272; and U.S. patentapplication Ser. No. 11/556,440, with the disclosures of each of theforegoing patents, published patent applications, and patent applicationserial numbers being hereby incorporated by reference as if set forthfully herein.

FIGS. 1A through 3E illustrate various embodiments of solid state lightemitter devices and related methods according to the present subjectmatter as disclosed and described herein. In some aspects, devices andmethods described herein comprise submount based surface mount design(SMD) light emitter devices, which are adapted for connection toportions of an electrical circuit, circuitry, a heat sink, and/or anyother electrically or thermally conductive surfaces. Light emitterdevices and methods herein can be formed over a panel substrate ofmaterial, processed as a batch of devices, and singulated from the panelas described, for example, in U.S. patent application Ser. No.14/292,331, filed on May 30, 2014, the disclosure of which is herebyincorporated by reference herein in the entirety.

FIGS. 1A to 1C illustrate a first embodiment of a light emitter device,generally designated 10. For simplicity and illustration purposes only,FIG. 1A illustrates device 10 without light emitters, however, lightemitters are illustrated in FIG. 1C. Device 10 can comprise a submount12 configured to support multiple light emitters. As described herein,the multiple light emitters can be configured into at least two (e.g.,or more than two) light emitter zones. Each light emitter zone cancomprise at least one light emitter, and in some aspects, multiple lightemitters.

Devices 10 described herein can be physically (dimensionally) scaled upor down to accommodate any suitable dimensional attribute requested by acustomer and/or consumer, for example, device 10 can comprise a submount12 having a length and a width measuring approximately 2.5 millimeters(mm)×2.5 mm or more, approximately 5 mm×5 mm or more, or approximately 7mm×7 mm or more. Submount 12 can comprise any shape that is square,non-square (e.g., circular, triangular, etc.), rectangular, ornon-rectangular. Any size and/or shape of submount 12 can be provided.Submount 12 can also comprise any thickness, such as for example betweenapproximately 0.25 mm and 2.0 mm thick. In some aspects, submount 12 isapproximately 0.6 mm, or 0.635 mm thick. Dimensional attributes asdescribed herein are exemplary, and any length, width, diameter,thickness, etc., of submount 12 can be provided.

Submount 12 can comprise any material requested by a customer, consumer,and/or any material that is application-specific (e.g., an electricallyinsulating material, a thermally conductive material, etc.). Submount 12can comprise a metal or a metallic material, a non-metallic material, acomposite material, a ceramic material, a laminate structure, amulti-layered material (e.g., PCB, MCPCB, etc.), a flexible material, orthe like. In some aspects, submount 12 is a ceramic material that ishighly reflective to visible light (e.g., greater than about 90%) andprovides mechanical support for and/or conduction of heat away frommultiple light emitters. In some aspects, submount 12 comprises asubstantially white, silvery white or transparent ceramic based materialthat is configured to improve light extraction and reflectance perdevice 10.

Submount 12 can comprise a highly reflective aluminum oxide (e.g.,alumina or Al₂O₃), aluminum nitride (AlN), zirconia (ZrO₂), etc., havingoptional reflective particles dispersed therein. Exemplary materials forproviding a panel and submounts 12 singulated therefrom are described inU.S. utility patent application Ser. No. 11/982,275, filed on Oct. 31,2007 and/or U.S. utility patent application Ser. No. 12/757,891, filedon Apr. 9, 2010. The entire contents of each of these references arehereby incorporated by reference herein.

In some aspects, submount 12 can comprise a surface over which one ormore light emitters (34, FIG. 1C) can be supported, mounted, and/orattached. Notably, device 10 can comprise a single and/or continuousmounting area A disposed over submount 12 for supporting multiple lightemitters (34, FIG. 1C). Mounting area A is illustrated in broken linesfor illustration purposes only, as it can include any size, shaperegion, and/or portion of submount 12 to which light emitters attach.Mounting area A can comprise a planar surface, a non-planar surface, ora combination of planar and non-planar surfaces over which lightemitters are provided.

Device 10 further comprises a plurality of electrically conductivecontacts or traces 14 for passing electrical current into one or morelight emitters (e.g., 34, FIG. 1C). In some aspects, light emitters(e.g., 34, FIG. 1C) that are disposed over mounting area A can beelectrically and/or physically configured into multiple discrete and/ordistinct light emitter zones for providing a single device 10 havingimproved color mixing, improved color quality, and/or improved coloruniformity. For example, light emitters (e.g., 34, FIG. 1C) can bephysically die attached, arranged, positioned, and/or otherwise providedwithin a first light emitter zone Z₁ and a second light emitter zone Z₂.First and second light emitter zones Z₁ and Z₁, respectively, can be butdo not have to be spatially distinct (e.g., visibly discrete). First andsecond light emitter zones Z₁ and Z₂, respectively, can be electricallyseparate or independent such that each zone can be independentlycontrollable, where desired.

In some aspects, at least a first pair of traces generally designated14A and at least a second pair of traces generally designated 14B can beprovided over submount 12 for independently supplying electrical currentto one or more light emitters (e.g., 34, FIG. 1C) disposed therebetween. Thus, first and second zones Z₁ and Z₂ can be electricallyand/or physically distinct or discrete. First pair of traces 4A can passelectrical current through one or more light emitters disposed in firstlight emitter zone Z₁, and second pair of traces 14B can pass electricalcurrent through one or more light emitters disposed in second lightemitter zone Z₂. More than two pairs of traces 14 can be provided perdevice 10 and/or more than two light emitter zones Z₁ can be providedper device 10, where desired (see e.g., FIG. 3E).

In some aspects, first and second pairs of traces 14A and 14B can eachcomprise an anode trace and a cathode trace for collectively passingcurrent into one or more light emitters (e.g., 34, FIG. 1C) electricallyconnected thereto. Each trace 14 can comprise an area of electricallyconductive material, such as metal or a metal alloy that is disposedover submount 12. Traces 14 can be provided on or over a top side orsurface of submount 12 via sputtering, electroplating, electrolessplating, depositing (e.g., via chemical, plasma, vapor, and/or physicaldeposition techniques), lithography processing, photoresist processing,stenciling, and/or any other known process or technique. Traces 14 canbe thin and optionally comprise one or more layers of material. Traces14 can, but do not have to be, disposed proximate outermost areas ofsubmount 12 and optionally covered with a reflective or non-reflectivestructure (e.g., walls 32, FIG. 1C). The size, shape, number, location,thickness, and/or material of traces 14 can be customized for use in avariety of different lighting applications.

Individual traces 14 (e.g., anode and cathode traces) can be physicallyseparated by a gap G. Electrical current can be communicated to traces14 from electrical contacts or pads (e.g., 22A, 22B, 24A, and 24B, FIG.1B) disposed on a bottom surface of submount 12 by electricallyconductive through-holes or vias, generally designated 16. Notably,traces 14 and bottom contacts (22A, 22B, 24A, and 24B, FIG. 1B) can beelectrically configurable such that device 10 can effectively becomesplit into first light emitter zone Z₁ and second light emitter zone Z₂.Light emitters (34, FIG. 1C) can be mounted to submount 12 andelectrically connected to a respective set of traces (e.g., first pair14A or second pair 14B) per zone. For example, first pair of traces 14Acan be configured to supply electrical current to light emitters (34,FIG. 1C) disposed in first zone Z₁ and second pair of traces 14B can beconfigured to supply electrical current to light emitters (34, FIG. 1C)disposed in second zone Z₂ A broken line is shown between first andsecond zones Z₁ and Z₂ for illustration purposes only to illustrate apseudo-boundary therebetween. In some aspects, a physical barrier, wall,dam, structure, material, mirror, reflector, or the like, can bedisposed between first and second zones Z₁ and Z₂, respectively,however, a physically divisive, partitioning structure is not required.

Notably, providing light emitters over a same (single, continuous)centralized surface or mounting area A that is devoid of apertures orholes can be advantageous in terms of thermal dissipation and/or thermalmanagement, as mounting area A can be provided over an external heatsink (not shown) or other component to more effectively spread heatand/or draw heat away from the mounting surface or area A. After dieattaching one or more light emitters (34, FIG. 1C) to mounting area A,light emitter zones Z₁ and Z₂ can then be physically partitioned ordivided via structures or barriers, however, physical separation of eachzone is not required. Light emitted by emitters mounted within eachemitter zone Z₁ and Z₂ can be emitted from a same light emitter surfaceas illustrated in FIG. 1C, or from multiple, physically divided lightemitter surfaces as illustrated by FIGS. 2B to 2D.

Still referring to FIG. 1A and in some aspects, the amount of electricalcurrent supplied to each light emitter zone (e.g., Z₁ and Z₂) and/or thevoltage range associated with each zone can be substantially the same ordifferent, thereby providing devices 10 that can be configured orcustomized in regards to electrical, thermal, physical, and/or opticalproperties or characteristics. In one exemplary embodiment, device 10can comprise customized in regards to electrical properties by providingdifferent quantities of light emitters and/or strings of seriallyconnected light emitters per zone, which can provide a single device 10having emitter zones Z₁ and Z₂ that are operable a both low and/or highvoltages. Similarly, in another exemplary embodiment, device 10 cancomprise customized optical properties by providing different colors,chip or string spacing, and/or patterns of light emitters per zone,which can provide a device 10 having improved color mixing and/oruniformity. In a further exemplary embodiment, device 10 can becustomized according to thermal properties. For example, heat can bemore highly concentrated in zones that have larger quantities orpopulations of light emitters. To compensate for this, a lower currentcan be supplied to light emitters in the more highly populated zones toallow the light emitters in that respective zone to run cooler at steadystate, which improves brightness and efficiency. Providing a singledevice having multiple (different) configurable and/or customizablelight emitter zones Z₁ and Z₂ can provide devices having improved colormixing, color uniformity, thermal management, and/or overall improvedefficiency.

Still referring to FIG. 1A and in some aspects, electrically conductivevias 16 are provided for facilitating electrical communication betweenbottom contacts (e.g., 22A to 24B, FIG. 1B) and traces 14. Electricalcurrent is then passed from traces 14 to light emitters (e.g., 34, FIG.1C) connected thereto. Vias 16 can comprise a plurality of openings,apertures, and/or holes extending through portions of submount 12. Vias16 pass electrical current between bottom contact/pads (FIG. 1B) and toptraces 14. Vias 16 can be, but do not have to be, vertically aligned orparallel with respect to a submount thickness or vertical axis. Vias 16can be filled and/or plated with electrically conductive material, suchthat top contacts or traces 14 can electrically communicate with bottomcontacts or pads (e.g., 22A, 22B, 24A, and 24B, FIG. 1B). Bottom pads(FIG. 1B) can be disposed on a backside or surface of submount 12, whichopposes the front side or surface upon which light emitters and traces14 are provided. Vias 16 can extend between the front and back surfacesof submount 12. Vias 16 can be formed in submount 12 via etching,drilling (e.g., laser or non-laser drilling), scribing, punching,machining, or the like, such that the vias 16 penetrate internally andextend within a portion of submount 12. In some aspects, vias 16 can beformed using batch processing step(s) (e.g., drilling, plating, etc.)prior to singulation of device 10 and respective submount 12 from alarger panel of devices.

Still referring to FIG. 1A and in some aspects, at least oneelectrostatic discharge (ESD) protection device 18 can be provided pertrace 14, such as first and second pairs of traces 14A and 14B,respectively. At least one ESD protection device 18 can electricallycommunicate to each pair (e.g., 14A, 14B) of traces via one or morewirebonds 20. ESD protection device 18 can be reversed biased betweentraces 14 with respect to light emitters (FIG. 1C) for preventingexcessive current from passing through device 10 during an ESD event.ESD protection devices 18 provide an alternative path for electricalcurrent to flow into and prevent ESD failures and/or damage to lightemitters. Exemplary ESD protection devices 18 as described, for example,in U.S. patent application Ser. No. 14/292,331, filed on May 30, 2014,the disclosure of which was previously incorporated by reference hereinin the entirety hereinabove. In some aspects, each ESD protection device18 is embedded or covered by one or more structures (e.g., walls, dams,etc.) so that it does not block and/or absorb a significant amount oflight.

Notably, traces 14 and ESD protection device 18 can optionally bedisposed proximate and/or confined to outermost edges of submount 12,such that each terminates under, below, and/or within portions of one ormore walls (e.g., 32, FIG. 1C). Wirebonds 20 extending from each ESDprotection device 18 can also terminate under, below, and/or withinportions of the dam or wall (e.g., 32, FIG. 1C). Stated differently,device 10 comprises an SMD in which electrical traces 14, wirebonds 20,and/or ESD protection devices 18 can be concealed (e.g., fully or atleast partially) by and/or within walls 32 (FIG. 1C). Traces 14 areeither fully concealed via walls (e.g., 32, FIG. 1C) or covered with afiller material (38, FIG. 1C). In some aspects, device 10 is devoid ofuncovered traces 14 on a top surface thereof. In some aspects, any typeof electrical component can be provided below and/or within wall (32,FIG. 1C). For example, a thermistor, resistor, capacitor, transistor, orthe like, may also be covered and/or concealed by a wall (32, FIG. 1C)of device.

FIG. 1B illustrates a bottom view of device 10 that opposes the view inFIG. 1A. Referring now to FIG. 1B, device 10 comprises a first side oredge 22 and an opposing, second side or edge 24. A plurality ofelectrical pads or contacts (e.g., SMD pads or contacts) is disposedalong each of first and second edges 22 and 24, respectively. Forexample, a first pair of pads or contacts 22A and 22B is disposed alongfirst edge 22 and a second pair of pads or contacts 24A and 24B isdisposed along second edge 24. A gap G₂ is disposed between each pair ofcontacts. A thermal element 26 is disposed between first and secondedges 22 and 24, respectively. Thermal element 26 can be configured todraw heat away from the light emitters, and dissipate it to an externalheatsink (not shown). Electrical contacts 22A to 24B are illustrated inone exemplary embodiment only. Any size, shape, location, orientation,and/or configuration of contacts 22A to 24B can be provided.

Notably, contacts 22A and 22B on first edge 22 can each comprise a sameelectrical polarity and contacts 24A and 24B on second edge 24 cancomprise a same electrical polarity that opposes the electrical polarityof contacts on first edge 22. In some aspects, contacts 22A and 22B eachcomprise anodes and contacts 24A and 24B each comprise cathodes. Anodecontacts (e.g., 22A and 22B) and cathode contacts (e.g., 24A and 24)collectively form independently controllable anode-cathode pairs forpassing separate electrical current between traces (14, FIG. 1A) andlight emitters (e.g., 34, FIG. 1C) connected thereto. For example,contact 22A and contact 24A are configured to collectively passelectrical current to light emitters in first zone Z₁ (FIG. 1A) andcontact 22B and contact 24B are collectively configured to passelectrical current to light emitters in second zone Z₂ (FIG. 1A). Eachanode/cathode pair of contacts (e.g., a first anode/cathode pair 22A/24Aand a second anode/cathode pair 22B/24B) is electrically independentfrom each other anode/cathode pair(s) of contacts, and can supplydifferent amounts of current to each light emitter zone, where desired.Just as device 10 utilizes multiple pairs of traces (e.g., 14A, 14B,FIG. 1A), device 10 likewise utilizes multiple pairs of contacts, wherea first pair of contacts comprises 22A and 24A and a second pair ofcontacts comprises 22B and 24B. Each pair of traces (14A, 14B, FIG. 1A)is electrically connected to respective pair of contacts. More than twopairs of contacts and more than two zones can be provided per device 10.

In some aspects, contacts 22A, 22B, 24A, and 24B comprise SMD pads orcontacts configured to electrically communicate with an externalcircuit, and optionally thermally communicate with an external heatsink. In some aspects, the circuit is also the heat sink. In otheraspects, the heat sink and circuit can comprise separate components.Contacts 22A, 22B, 24A, and 24B can electrically communicate with traces14 (FIG. 1A) by the one or more internally disposed vias 16.

Contacts 22A, 22B, 24A, and 24B can comprise metallic bodies or portionsof electrically conductive material that can be attached to submount 12via adhesive, solder, glue, epoxy, paste, silicone, or any othermaterial. In other aspects, contacts 22A, 22B, 24A, and 24B can comprisemetallic bodies or portions of material that can be pressed into a greenceramic tape and then co-fired with submount 12. In other yet furtheraspects, contacts 22A, 22B, 24A, and 24B can be applied to submount 12via plating, sputtering, conductive paste screen-printing, or the like.In some aspects, a conductive Ag paste can be used to form contacts 22A,22B, 24A, and 24B.

Referring now to FIG. 1C, a perspective top view of device 10 is shown.Device submount 12 comprises a bottom surface 28 over which contacts(e.g., 22A, 22B, 24A, and 24B) are disposed and an upper surface 30 overwhich traces 14, at least one dam (e.g., retention structure) or wall32, and one or more light emitters 34 are disposed. A filler material 38is disposed between inner surfaces of wall 32, for example, in a cavityformed by wall 32. Features disposed below wall 32 and filler material38 are indicated in broken lines, as such features are present, but maynot be visible from the outside of device 10. Filler material 38 cancomprise a substantially symmetric (regular) shaped light emittersurface that is configured to emit light generated by light emitters 34disposed below filler material 38. The light emitter surface of fillermaterial 38 can be subdivided via one or more additional structures orpartitions (e.g., 52, 54 FIGS. 2B to 2D). However, each subdividedstructure or portion of filler material 38 can also be symmetric about acentral axis, and in some aspects comprise multiple lines of symmetryabout the central axis. Filler material 38 is optional, and in someaspects device 10 comprises a molded lens or a lens-less device.

A plurality of light emitters 34 can be disposed over submount 12. Lightemitters 34 can comprise LED chips that are electrically connected inseries and/or parallel between pairs of traces 14 (e.g., ananode/cathode pair). Any size (dimension) of light emitters 34 can beprovided, for example, chips that are 1 mm×1 mm or smaller may beprovided, for example, chips that are 250 μm×250 μm, 350 μm×350 μm, 500μm×500 μm, etc. Any size, shape, color, and/or quantity of emitters 34can be provided per zone. At least two pairs (e.g., 14A, 14B) of traces14 can be provided per device 10, where a first pair of traces (e.g.,14A, FIG. 1A) supplies electrical current to light emitters 34 in firstzone Z₁ and a second pair of traces (e.g., 14B) supplies electricalcurrent to light emitters 34 in second zone Z₂. Each pair of traces 14can supply electrical current to light emitters 34 via wires and/orwirebonds 36. Notably, traces 14 and at least some wirebonds 36 can beat least partially or fully disposed under, below, and/or within wall32.

In some aspects, light emitters 34 are physically and/or electricallyconfigured in multiple different and electrically independent lightemitter zones (e.g., Z₁ and Z₂). Each zone can emit light through asingle, undivided portion of filler material 38 and from a single,undivided light emitter surface (e.g., an upper surface of filtermaterial 38). In other aspects, light emitters 34 in multiple lightemitter zones (e.g., Z₁ and Z₂) can emit light from separate portions offiller material (e.g., FIG. 2B) having separate light emitter surfaces.Notably, light emitters 34 configured within multiple light emitterzones (e.g., Z₁ and Z₂) are electrically independent, so that each zoneis addressed individually. Light emitted from each zone (e.g., Z₁ andZ₂) can combine, mix, and emit the mixed light from a single, same(undivided) light emitter surface. Color uniformity and/or quality(e.g., higher CRI, brighter light, more vivid light, more natural whitelight, etc.) can be improved via multi-zone light emission.

In some aspects, a single light emitter 34 is provided per zone (e.g.,Z₁ and Z₂). In other aspects, multiple light emitters 34 are providedper zone. Any combination could be used. Where multiple light emitters34 are provided per zone, the emitters can be serially connected in oneor more strings of emitters. Each string of light emitters 34 can beelectrically connected to other strings in parallel. Different sizes,shapes, spacings (chip and string spacings), structures, quantities,colors, and/or electrical connectivity of light emitters 34 can beprovided in different zones (e.g., Z₁ and Z₂). The sizes, shapes,spacing, structures, colors, quantities, and/or connectively of emitters34 provided per zone (e.g., Z₁ and Z₂) can be customized for use invarious different lighting applications and/or at various differentvoltages for providing a desired color and/or light output from device10.

Still referring to FIG. 1C and in some aspects, wall 34 comprises areflective material (e.g., a reflector), a non-reflective material, alight-absorbing material, a light blocking material, a clear(transparent) material, a white material, a particle loaded (e.g.,reflective or light scattering particles), a phosphor loaded material, ablack material, or the like. Using a clear wall may be advantageous byincreasing or promoting color mixing between light emitter zones,improve uniformity, and/or for increasing the viewing angle associatedwith device 10. Wall 32 can be formed by any method or technique. Forexample, wall 32 can comprise a dispensed dam of material or a moldedmaterial. Wall 32 can comprise a single, integral and continuous layerof material disposed over submount 12, or wall 32 can be comprised ofmultiple non-integral, non-overlapping wall portions. Any size, shape,and/or configuration of wall 32 can be provided.

Filler material 38 can be retained via wall 32. In some aspects, fillermaterial 38 is dispensed between portions of at least two opposing innersurfaces of wall 32 via a dispensing member or tool. In other aspects,filler material 38 can be at least partially molded and cured. Fillermaterial 38, or any portion thereof over (e.g., over different zones),can comprise a texturized surface, a filtering surface, a diffusingsurface, or the like. Filler material 38 can comprise an optical elementfor producing a certain shape, color, and/or beam pattern of light.Filler material 38 can comprise a planar surface, a curved surface, adomed surface, and/or combinations thereof.

In some aspects, filler material 38 comprises an encapsulant, where atleast a portion of the encapsulant is disposed on a same side or surfaceof submount 12 to which light emitters 34 are mounted, and/or a sameside or surface to which traces 14 are deposited. In some aspects,filler material 38 is formed directly or indirectly over a top surfaceof submount 32, and disposed directly over at least one light emitter34. In some aspects, filler material 38 can comprise a silicone matrix,encapsulant, or a plastic material, which can be deposited or dispenseddirectly over submount 12 without incurring time or expense associatedwith overmolding a lens. Filler material 38 can be dispensed to anyheight between surfaces of wall 32, and can comprise a height that isflush with, greater than, or less than a height of an upper surface ofwall 32. In some aspects, filler material 38 can come over and cover thetop and/or sides or surfaces of wall 32.

Filler material 38 can provide both environmental and mechanicalprotection of device 10. In some aspects, an optional layer of opticalconversion material(s), such as phosphor(s) or lumiphor(s), can beapplied directly over the one or more light emitters 34 and/or over oneor more surfaces of filler material 38 (e.g., an inner, outer, upper, orlower surface) for producing cool and/or warm white output. In otheraspects, optical conversion material is uniformly or non-uniformlydispersed within filler material 38. Optical conversion material cancomprise one or more phosphors or lumiphors (e.g., yellow, red, and/orgreen phosphor) which become activated by light emitted from the one ormore light emitters 34. In some aspects, optical conversion material isprovided when filler material 38 is in liquid form and fixed therein asfiller material 38 cures.

Notably, device 10 is devoid of a costly leadframe encased within moldedplastic, but rather utilizes thin electrically conductive traces 14,which can be customized with respect to size, quantity, placement,layout, and/or electrical configuration with respect to light emitters34 and bottom contacts (e.g., 22A, 22B, 24A, 24B, FIG. 1B). Individuallight emitter devices 10 can each comprise an individual submount 12over which multiple light emitters 34 are physically and/or electricalconfigured into multiple light emitter zones (Z₁, Z₂) for providingcustomized light emission.

FIGS. 1A to 1C are exemplary only, and as will be appreciated by thoseof skill in the art, aspects of the light emitters, traces, reflectorsand/or optical elements can be customized to provide light emitterdevices operable at various electrical and/or optical specifications percustomer and/or consumer requests.

FIGS. 2A to 2D illustrates various embodiments of different lightemitter zone characteristics, including but not limited to differentlight emitters (e.g., different placement, sizes, shapes, spacing,electrical configuration, etc.) per zone within solid state lightemitter devices. Each device in FIGS. 2A to 2D comprise a submount 42,multiple light emitters 44 disposed over submount 42, a plurality ofwires 46 extending from the one or more light emitters 44, and a wall orretention structure 48 disposed over submount 42. Retention structure 48covers one or more electrical devices, such as ESD protection devices(FIG. 1C) and/or wires 46. Retention structure 48 is configured toretain a filling material (e.g., 38, FIG. 1C) and can comprise anymaterial (e.g. a reflector, a mirror, a non-reflective material, etc.).Retention structure 48 can be disposed over and cover traces (e.g., 14,FIG. 1A) and/or vias (e.g., 16), FIG. 1A), however, the traces and viasare not shown in FIGS. 2A to 2D for illustration purposes.

FIG. 2A illustrates a first solid state light emitter device, generallydesignated 40A. Device 40A includes a first light emitter zone Z₁ and asecond light emitter zone Z₂ configured over a mounting surface. Eachzone Z₁ and Z₂ comprise at least one light emitter 44 that receiveselectrical current from a pair of traces (e.g., 14A, 14B, FIG. 1A). Insome aspects, multiple strings of serially connected light emitters 44are provided over submount 42. Each string of light emitters 44 can beconnected in parallel between the respective pair of traces (e.g., 14A,14B, FIG. 1A). In some aspects, light emitters 44 comprise LED chipsconfigured to emit light that is primarily blue, primarily red,primarily green, cyan, amber, RDO, BSY, UV, IR, or the like, uponactivation with electrical current. Notably, the quantity, size, shape,orientation, structure, number of strings, and/or electricalconnectivity of light emitters can vary per zone. A single device 40A iscustomizable and/or configurable in regards to color, size, voltage,thermal properties, optical properties, physical properties, electricalproperties, or the like. In some aspects, the quantity, size, shape,orientation, structure, number of strings, and/or electricalconnectivity of light emitters can be the same per zone. In otheraspects, each zone is different. Any arrangements and/or connectivity oflight emitters can be provided, where each zone is independentlyaddressable.

As FIG. 2A illustrates, first and second light emitter zones Z₁ and Z₂can emit light from a same light emitter surface 50. The light emittersurface can comprise a surface of submount 42 or a surface of a fillermaterial (not shown) disposed between portions of retention structure48. Emitting light from a single light emitter surface or area 50 canadvantageously allow light from separately driven (independent) LEDchips to mix for improving color uniformity and/or allow provision ofspecific beam patterns or shaping. Any number of light emitter zones Z₁and Z₂ can be provided per device 40A. LED chips (e.g., 44) can beconfigured to activate a yellow, red, and/or green phosphor disposedeither directly over the chips, dispersed within at least one layer offiller material (e.g., 38, FIG. 1C) and/or over or within a portion ofretention structure 48 for producing cool and/or warm white output.

FIG. 2B is another embodiment of a solid state light emitter devicegenerally designated 40B. Device 40B comprises an intermediate structure52 disposed between first light emitter zone Z₁ and second light emitterzone Z₂. Structure 52 can comprise a dam, wall, a mirror, alight-blocking structure, a reflective structure, a filter, a blackstructure, a white structure, a transparent (clear) structure, or anyother type of structure and/or material that is configured to divide,partition, or otherwise separate first light emitter zone Z₁ and secondlight emitter zone Z₂. In some aspects, intermediate structure 52 can beintegrally formed with retention structure 48 and can comprise a samematerial as retention structure 48. Separating first light emitter zoneand second light emitter zone Z₁ and Z₂, respectively, can beadvantageous in providing a device that emits both a warmer color and acooler color. For example, first zone Z₁ can be configured to emit awarmer color (e.g., a warm white, red, amber, etc.), and second zone Z₁can be configured to emit a cooler color (e.g., a cool white, blue,etc.), or vice versa, for providing a customized light emission.

In some aspects, first zone Z₁ is configured to emit light having alower correlated color temperature (CCT) than second zone Z₂, or viceversa. CCT is the proximity of the light source's chromaticitycoordinates to the blackbody locus, as a single number rather than thetwo required to specify a chromaticity, which can be measured in Kelvin(K). For exemplary purposes only and in some aspects, at least one zone(e.g., Z₁ or Z₂) can be configured to emit light having a CCT of betweenapproximately 1800K and 2400K, between approximately 2700K and 3000K,between approximately 3200K and 4800K, and/or between approximately5000K and 6500K. As each zone (e.g., Z₁ or Z₂) is independentlyaddressable (e.g., electrically independent), dimmable devices can alsobe provided, where current supplied to each color temperature zone isincreased or decreased as desired. In some aspects, the colortemperature or CCT associated with each zone (e.g., Z₁ or Z₂) can beconfigured and/or controlled based upon a string design, a chip design,and/or electrical current control.

Device 40B is configured to emit light from a first light emittersurface or area 50A and a second light emitter surface or area 50B thatare disposed on opposing sides of intermediate structure 52. Each lightemitter area 50A and 50B can comprise a regular shape that are notasymmetrical, and that has symmetry about at least one axis and/ormultiple lines of symmetry.

FIG. 2C is another embodiment of a solid state light emitter devicegenerally designated 40C. As FIG. 2C illustrates, each light emitterzone (Z₁ and Z₂) can be configured differently and/or have differentfeatures or characteristics. In some aspects, first zone Z₁ can comprisedifferent physical and electrical configurations than second zone Z₂.For example, first zone Z₁ can comprise a different chip quantity,string quantity, chip-per-string configuration, chip spacing, stringpattern, string spacing, etc., than second zone Z₂ In some aspects,first zone Z₁ can comprise a single string of serially connected lightemitters 44 whereas second zone Z₂ can comprise multiple strings ofserially connected light emitters 44. In further aspects, first zone Z₁can comprise more light emitters per string than second zone Z₂. Infurther aspects, first zone Z₁ can comprise a fewer quantity of emitters44 than second zone Z₂. In other aspects, first zone Z₁ can comprise afirst chip spacing or pitch P₁ that is different from a second chipspacing or pitch P₂ associated with second zone Z₂

In each zone (e.g., Z₁ and Z₂), light emitters 44 can be provided atequal distances from each other, or randomly spaced apart. In someaspects, light emitters 44 are spaced apart from each other by at leastapproximately 30 μm or more, at least approximately 50 μm or more, atleast approximately 100 μm or more, at least approximately 200 μm ormore, or more than 300 μm. In some aspects, first pitch P₁ can besmaller (e.g., tighter) than second pitch P₂. First pitch P₁ can differfrom second pitch P₂ by +/−approximately 10 μm, by +/−approximately 50μm, or by more than 100 μm. The amount of current supplied to the zonehaving closer spaced or tighter packed light emitters can also differfor thermal purposes, where desired.

FIG. 2D is a further embodiment of a solid state light emitter devicegenerally designated 40D. As FIG. 2D illustrates, each light emitterzone (Z₁ and Z₂) can be separated by a non-integral or separately formedintermediate dam or structure 54. In some embodiments, intermediatestructure comprises a different material, color, shape, size, thickness,and/or reflective or non-reflective properties than retention structure48. In some aspects, structure 54 is a reflector or a non-reflector. Inother aspects, structure 54 comprises mirror and/or has mirroredsurfaces. In other aspects, structure 54 is transparent (clear) forallowing light and colors to mix between the different zones. In furtheraspects, structure 54 can be used in combination with any type of wallor retention structure 48 that can be white (reflective),non-reflective, mirrored, faceted, smooth, transparent, or the like.Retention structures (e.g., 48, 52, 54, etc.) as described herein cancomprise any suitable material, thickness, height, and/or shape(sectional or planar shape) configured to produce a color, beam, and/orpattern of light as suitable for many different lighting applications.

FIGS. 2A to 2D are for exemplary purposes only, and as will beappreciated by those of skill in the art, the multiple light emitterzones (e.g., Z₁ and Z₂) can differ in physical, electrical, and/oroptical respects other than those specifically shown. For example, eachzone can differ from one or more other zones in regards to a chip color,chip size, chip type, chip spacing, chip quantity, chip quantity perstring, chip structure (e.g., vertical or horizontal), chiporientation/alignment with regards to other chips, chip patterns (e.g.,linear and non-linear strings of chips), electrical configuration,electrical current supplied thereto, voltage, filler material, phosphorloading, phosphor content, any combination(s) thereof, or the like.Devices herein can comprise multiple light emitter zones that arecustomizable to provide light emitter devices operable at variouselectrical and/or optical specifications per customer and/or consumerrequests.

FIGS. 3A to 3E schematically illustrate multiple light emitter zonesdisposed in a single solid state light emitter device according to thedisclosure herein. Each device in FIGS. 3A to 3E can comprise a submount62 and at least one retaining structure, dam, or wall 64. Forillustration purposes only, FIGS. 3A to 3E illustrate light emitterzones (i.e., designated “Zone A”, “Zone B”, etc.) as being separated byone or more broken lines. The broken lines are used for illustrationpurposes only to illustrate possible placement of each light emitterzone relative to at least one other light emitter zone. In some aspects,the two or more light emitter zones can emit light from a same, single,undivided light emitter surface or area (e.g., FIG. 1C). In otheraspects, the broken line illustrates placement of a barrier, dam, orwall that physically separates the light emitter surface or area (seee.g., FIGS. 2B to 2D) into two or more portions. Each light emitter zonecan comprise a regular shape that is symmetrically disposed about atleast one axis or plane. Regular shapes advantageously provide regularbeam patterns or shapes useful in a variety of lighting applications.

FIG. 3A illustrates one embodiment of a light emitter device 60A thatcomprises a first light emitter zone designated “Zone A” and a secondlight emitter zone designated “Zone B”. At least two electricallyindependent and individually operable zones can be provided. In someaspects, more than two zones are provided. Zone A and Zone B can bedisposed directly adjacent to each other, with or without a wall, dam,or other retention structure therebetween.

FIG. 3B is a sectional view of FIG. 3A. Each zone can comprise at leastone, and in some aspects multiple light emitters 66. Where multipleemitters 66 are provided per zone, each light emitter can emit a samecolor per zone or different colors of light per zone. Emitters 66 inZone A can differ from emitters 66 in Zone B in regards to the chipsize, shape, color, quantity, structure, and/or electrical connectivity(e.g., series, parallel, or a combination thereof).

In some aspects, Zone A can comprise a first filler material 68A andZone B can comprise a second filler material 68B. First filler material68A and second filler material 68B can comprise a same material ordifferent materials. Exemplary materials that can be used as fillermaterials 68A and 68B include silicone (e.g., any silicone carriermaterial, silicone resin, or silicone encapsulant), epoxy, resin, atransparent (clear) material, plastic, or the like. In some aspects,first filler material 68A and/or second filler material 68B can eachcomprise one or more phosphors, binders, reflective particles, diffusiveparticles, filtering particles, or the like, that are loaded orotherwise dispersed within the filler carrier material. Where used, theparticles can be uniformly loaded or non-uniformly loaded.

In some aspects, first filler material 68A is substantially the same assecond filler material 68B. In other aspects, first filler material 68Ais not the same (different) as second filler material 68B. Thedifferences between filler materials used in each zone can bestructural, visual, optical, or chemical differences. For example, firstmaterial 68A can differ from second material 68B in regards to any ofthe materials used in providing the respective filler material, phosphorcontent, phosphor loading, phosphor type (e.g., chemical composition orcolor), the presence of light reflective, diffusing, and/or filteringparticles, the filler color, the degree of filler transparency (e.g.,varying in any degree from being optically clear to opaque), thepresence of a texturized surface, or the like.

FIG. 3C illustrates another solid state light emitter device generallydesignated 60C. Device 60C can comprise independently controlled zonesthat receive electrical signal from independently controllable pairs ofSMD contact pads (e.g., FIG. 1B) In some aspects, the zones are linearlyarranged and/or parallel to each other over submount 62 (e.g., FIG. 3A).FIG. 3C illustrates non-parallel zones, which may be useful in providingdifferent colors, patterns, and/or shaped beams of light. As FIG. 3Cillustrates, at least two light emitter zones are provided over a singlesubmount 62 and on a single device 60C. The zones can oppose each otherand comprise non-square, triangular shapes spanning at least two edgesand one corner of submount 62. Any different sizes and/or shapes ofemitter zones can be provided per device.

FIG. 3D is a further embodiment of a solid state light emitter devicegenerally designated 60D. Device 60D comprises two con-centric and/orcoaxial light emitter zones. Each zone is exclusive, discrete, andindividually powered. Different light emitter zones can independentlyemit light, where the light emitted thereby can be the same color ordifferent colors. Emitters disposed in each zone can be operable a sameelectrical current or different currents for providing a single deviceoperable at different voltages. As FIG. 3D illustrates, Zone B isdisposed proximate the center of submount 62, while Zone A surrounds allsides and the perimeter of Zone B. Zone B may run hotter than Zone A, aslight emitters may be more densely packed therein. Thus, the electricalcurrent provided to Zone B may be lower than the current being providedto Zone A. Electrical current can be strategically provided to each zonefor providing a more efficient device having a higher quality of light.

FIG. 3E is a further embodiment of a solid state light emitter devicegenerally designated 60E. Device 60E comprises more than twoindependently controlled light emitter zones (i.e., Zone A to Zone D).Any two zones can emit light having the same optical properties (e.g.,brightness, color, etc.) or each zone may emit light having differentoptical properties. Each zone can also comprise different physical,chemical, thermal, and/or electrical properties, where desired. Anynumber, location, size, and/or shape of light emitter zones can beprovided over submount 62. The multiple zones emit light that iscustomized and/or configurable for use in many different lightingapplications. In some aspects, each zone emits a different CCT forincreasing the overall color rendering index (CRI). Combined emissionsfrom the multiple zones per devices described herein embody a CRI valueof at least 80, at least 85, or at least 90 or more.

In some aspects, devices described herein are configured to emit whitelight having a reference point on the blackbody locus (e.g., 1931 CIEChromaticity Diagram) having a color temperature (e.g., CCT) of lessthan or approximately equal to 6500 K, less than or approximately equalto 5000 K, less than or approximately equal to 4000 K, less than orapproximately equal to 3500 K, less than or approximately equal to 3000K, or less than or approximately equal to 2700 K.

Solid state light emitter devices and methods herein can providecustomized lighting components having improved color rendering and/orlight emissions that are easily batched processed and produced. Amultitude of different lighting devices, having customized colors,brightness, voltages, power, layout, sizes, and/or shapes can beprovided without the expense of providing leadframe components.

Embodiments as disclosed herein may, for example and without limitation,provide one or more of the following beneficial technical effects:improved color rendering; improved color uniformity; improved colorquality; reduced cost; reduced processing time; simplified processing;improved light extraction; improved brightness; and/or the improvedability to vary component features or characteristics.

While the devices and methods have been described herein in reference tospecific aspects, features, and illustrative embodiments, it will beappreciated that the utility of the subject matter is not thus limited,but rather extends to and encompasses numerous other variations,characteristics, modifications and alternative embodiments as willsuggest themselves to those of ordinary skill in the field of thepresent subject matter, based on the disclosure herein. Variouscombinations and sub-combinations of the structures and featuresdescribed herein are contemplated and will be apparent to a skilledperson having knowledge of this disclosure.

Any of the various features and elements as disclosed herein can becombined with one or more other disclosed features and elements unlessindicated to the contrary herein. Correspondingly, the subject matter ashereinafter claimed is intended to be broadly construed and interpreted,as including all such variations, modifications and alternativeembodiments, within its scope and including equivalents of the claims.

What is claimed is:
 1. A solid state light emitter device comprising: asubmount comprising an upper surface and a bottom surface; at least afirst pair and a second pair of electrically conductive contactsdisposed on the bottom surface of the submount, the first pair ofcontacts being electrically independent from the second pair ofcontacts; and multiple light emitters disposed on the upper surface ofthe submount, wherein the multiple light emitters are configured into atleast a first light emitter zone that is electrically independent from asecond light emitter zone.
 2. The device of claim 1, wherein the firstand second light emitter zones contain a same quantity of lightemitters.
 3. The device of claim 1, wherein the first and second lightemitter zones contain a different quantity of light emitters.
 4. Thedevice of claim 1, further comprising at least a first pair and a secondpair of electrically conductive traces disposed on the upper surface ofthe submount, wherein the first pair of traces electrically communicateswith the first pair of contacts, and the second pair of traceselectrically communicates with the second pair of traces.
 5. The deviceof claim 4, wherein multiple strings of serially connected lightemitters are disposed between the first and second pairs of electricallyconductive traces.
 6. The device of claim 5, wherein the first lightemitter zone comprises a different number of strings of seriallyconnected light emitters than the second light emitter zone.
 7. Thedevice of claim 1, wherein light emitters in the first light emitterzone differ from light emitters in the second light emitter zone inregards to a chip size, a chip spacing, a chip structure, or a chipcolor.
 8. The device of claim 1, wherein the first light emitter zone isconfigured to emit light having a different correlated color temperature(CCT) than the second light emitter zone.
 9. The device of claim 1,further comprising a filler material disposed over the first lightemitter zone and the second light emitter zone.
 10. The device of claim9, wherein a continuous layer of the filler material is disposed overlight emitters in the first and second light emitter zones.
 11. Thedevice of claim 9, wherein the filler material is separated into atleast a first portion of filler material disposed over the first lightemitter zone and a second portion of filler material disposed over thesecond light emitter zone by an intermediate retaining structure. 12.The device of claim 11, wherein the first portion of filler materialdiffers from the second portion of filler material in regards to aphosphor type, a phosphor content, a phosphor loading, or an encapsulantmaterial.
 13. A solid state light emitter device comprising: a submount;a plurality of pairs of electrically conductive traces disposed over thesubmount, wherein each pair of electrically conductive traces iselectrically independent; and a plurality of light emitters disposedover the submount, the light emitters configured in at least two lightemitter zones between the plurality of electrically conductive traces,and each light emitter is configured to emit light from a light emittersurface that has at least two lines of symmetry about a central axis ofthe submount.
 14. The device of claim 13, wherein the two light emitterzones contain a same quantity of light emitters.
 15. The device of claim13, wherein the two light emitter zones contain a different quantity oflight emitters.
 16. The device of claim 13, wherein each pair ofelectrically conductive traces is in electrically communication with arespective pair of electrically conductive contacts disposed on a bottomsurface of the submount.
 17. The device of claim 13, wherein multiplestrings of serially connected light emitters are disposed between eachpair of electrically conductive traces.
 18. The device of claim 17,wherein the two light emitter zones comprises a different number ofstrings of serially connected light emitters.
 19. The device of claim13, wherein the two light emitter zones comprise a first light emitterzone and a second light emitter zone, and wherein light emitters in thefirst light emitter zone comprise a different chip size, a differentchip spacing, a different chip structure, or a different chip color thanlight emitters in the second light emitter zone.
 20. The device of claim13, wherein the each light emitter zone is configured to emit lighthaving a different correlated color temperature (CCT) than the secondlight emitter zone.
 21. The device of claim 13, further comprising afiller material disposed over the two light emitter zones.
 22. Thedevice of claim 21, wherein a continuous, undivided layer of fillermaterial is disposed over light emitters in the two light emitter zones.23. The device of claim 21, wherein the filler material is separatedinto at least a first portion of filler material disposed over a firstlight emitter zone and a second portion of filler material disposed overa second light emitter zone by an intermediate retaining structure. 24.The device of claim 23, wherein the first portion of filler materialdiffers from the second portion of filler material in regards to aphosphor type, a phosphor content, a phosphor loading, or an encapsulantmaterial.
 25. A method of providing a solid state light emitter device,the method comprising: providing a submount comprising an upper surfaceand a bottom surface; providing at least first pair and a second pair ofelectrically conductive contacts on the bottom surface of the submount,the first pair of contacts being electrically independent from thesecond pair of contacts; providing multiple light emitters on the uppersurface of the submount; and electrical configuring the multiple lightemitters into at least a first light emitter zone that is electricallyindependent from a second light emitter zone.
 26. The method of claim25, further comprising providing a same quantity of light emitters inthe first and second light emitter zones.
 27. The method of claim 25,further comprising providing a different quantity of light emitters inthe first and second light emitter zones.
 28. The method of claim 25,further comprising electrically connecting the multiple emitters toeither a first pair or a second pair of electrically conductive tracesdisposed on the upper surface of the submount, wherein the first pair oftraces electrically communicates with the first pair of contacts and thesecond pair of traces electrically communicates with the second pair oftraces.
 29. The method of claim 28, further comprising seriallyconnecting light emitters into multiple strings of light emittersbetween the first and second pairs of electrically conductive traces.30. The method of claim 29, wherein the first light emitter zonecomprises a different number of strings of serially connected lightemitters than the second light emitter zone.
 31. The method of claim 25,further comprising providing different chip sizes, chip spacings, chipstructures, or chip colors in the first and second light emitter zones.32. The method of claim 25, further comprising emitting light from thefirst light emitter zone that has a different correlated colortemperature (CCT) than the second light emitter zone.
 33. The method ofclaim 25, further comprising dispensing a filler material disposed overthe first light emitter zone and the second light emitter zone.
 34. Themethod of claim 33, wherein a continuous layer of the filler material isdispensed over light emitters in the first and second light emitterzones.
 35. The method of claim 33, wherein further comprising separatingthe filler material into at least a first portion of filler materialdisposed over the first light emitter zone and a second portion offiller material disposed over the second light emitter zone by anintermediate retaining structure.
 36. The method of claim 35, whereinthe first portion of filler material differs from the second portion offiller material in regards to a phosphor type, a phosphor content, aphosphor loading, or an encapsulant material.